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Mrinal brings in
over 10 years of industry experience in VLSI,
Mixed Signal IC Design and RF System on Chip
(SOC) product development.
Prior to
Sankalp, Mrinal was the Manager for Bluetooth RF
Product development in Texas Instruments India.
Detailed
Description
Mrinal Das
joined Texas Instruments India in 1996 as an IC
Design Engineer. He was part of the project team
that delivered the first system on chip codec
for voice band modems.
In 1998, Mrinal
was the project lead for a core team that
started a major new activity in TI India -
design of Digital Still Camera front End. After
that he held various technical and leadership
roles in Mixed Signal group and was instrumental
to create solid foundations for Digital Still
Camera (DSC) and Cable Modem team. Today both
these teams create some of the strongest
pillars, providing state of the art products
from TI India.
In 2000, Mrinal was
assigned a responsibility creating analog
friendly process technology in digital deep
sub-micron process nodes. His involvement
continued while working together with TI Silicon
Technology Development (SiTD) team for analog/RF
specific device needs.
From 2001 onwards
Mrinal was deeply involved in RF SOC
developments in different technical and
Management roles. This involves the Digital
Radio Processor development, Wireless LAN SOC
and Bluetooth Enhanced Data Rate single chip
solution.
In 2002, he was elected Member
Group of Technical Staff (MGTS) in TI India for
his technical contributions to TI’s
success.
Mrinal has 4 US patents granted,
and more than 4 International IEEE publications.
He was elected IEEE Senior Member in 2006, and
also serves the IEEE Review Committee for VLSI
Conference.
Mrinal has a Bachelors Degree
in Electronics and Communications Engineering
from Jadavpur University in 1996 . One of his
many passions involves taking Mixed Signal
semiconductor to different parts of
India. |
