Mrinal Das

Mrinal is the VP of Engineering at Sankalp Semiconductor.

Prior to Sankalp, Mrinal was the Manager for Bluetooth RF Product development in Texas Instruments India. Mrinal brings in over 15 years of industry experience in VLSI, Mixed Signal IC Design and RF System on Chip (SOC) product development.

Mrinal Das joined Texas Instruments India in 1996 as an IC Design Engineer. He was part of the project team that delivered the first system on chip codec for voice band modems. In 1998, Mrinal was the project lead for a core team that started a major new activity in TI India – design of Digital Still Camera front End. After that he held various technical and leadership roles in Mixed Signal group and was instrumental to create solid foundations for Digital Still Camera (DSC) and Cable Modem team. Today both these teams create some of the strongest pillars, providing state of the art products from TI India.

In 2000, Mrinal was assigned a responsibility creating analog friendly process technology in digital deep sub-micron process nodes. His involvement continued while working together with TI Silicon Technology Development (SiTD) team for analog/RF specific device needs. From 2001 onwards Mrinal was deeply involved in RF SOC developments in different technical and Management roles. This involves the Digital Radio Processor development, Wireless LAN SOC and Bluetooth Enhanced Data Rate single chip solution.

In 2002, he was elected Member Group of Technical Staff (MGTS) in TI India for his technical contributions to TI’s success. Mrinal has 4 US patents granted, and more than 4 International IEEE publications. He was elected IEEE Senior Member in 2006, and also serves the IEEE Review Committee for VLSI Conference.

Mrinal has a Bachelors Degree in Electronics and Communications Engineering from Jadavpur University in 1996 . One of his many passions involves taking Mixed Signal semiconductor to different parts of India